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MTL - Technological Empire Starts From Shanzhai System - Chapter 346 Artificial intelligence chip!
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Chapter 345 3D chip stacking technology!
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Chapter 347 Crazy audience!
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... the heat to be dissipated evenly and quickly.
Among them, the cobalt interconnection technology has played an indelible contribution to Lin Xuan's 3D chip stacking technology because of its low resistivity, low heat generation, and good thermal conductivity!
So one minute on stage, ten years off stage.
Lin Xuan introduced the 3D chip stacking technology calmly on the stage, but in the virtual space behind it, it actually cost nearly hundreds of billions of dollars i ...
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